Production process of multilayer circuit board and double sided PCB

1. Production process of Multilayer PCB tin plate / gold plate:

Cutting → inner layer cutting → lamination → drilling → copper sinking → line drawing → etching → solder resistance → lettering → tin spraying (or gold sinking) - cutting V-HEAD (no need for partial cutting) → flying measurement → vacuum packaging.

2. Production process of multilayer circuit board gold plating board:

Cutting → inner layer → lamination → drilling → copper plating → circuit → electricity pulling → gold plating → etching → solder resistance → character → Gong edge → V cutting → flying measurement → vacuum packaging.

3. PCB double sided circuit board tin plate / gold plate production process:

Cutting → drilling → copper deposition → wiring → electricity pulling → etching → solder resistance → character → tin spraying (or gold deposition) - Gong edge-v cutting (some boards do not need it) → flying needle test → vacuum packaging.

4. Production process of PCB double-sided circuit board and gold-plated board:

Cutting → drilling → copper plating → circuit → drawing → gold plating → etching → solder resistance → character → Gong edge → V cutting → flying needle test → vacuum packaging.