Causes of multi layer circuit board failure

1. The quality of circuit board raw materials does not meet the standard.

The quality of PCB raw materials is the basic quality of multilayer circuit board. The quality of its own circuit board can not be closed, and the circuit board will appear bubbles, circuit board layer, board warpage, uneven thickness and other phenomena.

2. The circuit board production process is not up to standard.

In the production process, each process should strictly implement the production process, and each process should be equipped with corresponding detection equipment to ensure the quality stability of multilayer circuit board. Because the production technology does not meet the standard, many circuit board factories only reduce the price, and the quality of the production line has nothing to do with it.

3. Circuit board production equipment does not meet the standard.

With the development of science and technology, multi-layer circuit board production equipment update faster and faster, the price is also more and more expensive. The fundamental way to improve the quality of PCB is to ensure the quality of equipment from the hardware, increase equipment investment, and make the equipment efficient and stable. Therefore, some small circuit board manufacturers can not buy expensive equipment, which eventually leads to the production of PCB sample quality.