Basic process of making HDI blind hole plate

Due to the influence of drilling tool, the cost of traditional PCB drilling is very high when the drilling diameter reaches 0.15mm, and it is difficult to improve again. The drilling of HDI blind hole plate no longer depends on the traditional mechanical drilling, but uses the laser drilling technology. 

The hole diameter of HDI blind buried hole plate is generally 3-5mil (0.076-0.127mm), and the line width is generally 3-4mil (0.076-0.10mm). The size of pad can be greatly reduced, so more line distribution can be obtained in unit area, resulting in high-density interconnection.

 
At present, HDI technology has been widely used, of which the first-order HDI has been widely used in the production of 0.5 pitch BGA PCB. The development of HDI technology promotes the development of chip technology, which in turn promotes the improvement and progress of HDI technology.